Advanced Electronics Materials Technologies: BizEsp launches OXFORD SOLDERS offering Solders, Solder Powders, Solder Pastes, Fluxes, Adhesives and BGA

Oxford, United Kingdon (PRWEB) February 25, 2008 -- BizEsp Limited, "The Electronics Materials Specialists", specialising in the application of fundamental sciences for advanced technology development and problem solving announced today the launch of its OXFORD SOLDERS brand in the China market for electronics assembly products. Product line up will include solder powders, solder pastes, fluxes and BGA spheres. Oxford Solders will provide highest technology products for robust Printed Circuit Board mass manufacturing with highest environmental responsibility.

Announcing the launch of Oxford Solders, CEO Dr Dosten Baluch and CTO Dr. Charles King outlined Oxford Solders mission to offer top quality products at prices competitive for local markets whilst ensuring that local clients in China and India are given local support for applications engineering and trouble shooting production issues. Dr. Baluch said that BizEsp has a powerful network of global experts that will provide top class client service with total commitment to problem solving, exceeding expectations and adding-value to client operations.

"BizEsp will provide excellence in local service, support and training to clients on clients own premises wherever the client is China whether it is Jiangsu, Sichuan or Guangdong, BizEsp experts will support the client and offer their deep and advanced experience in PCB assembly engineering operations," he said.

In order to meet this promise, BizEsp has deployed top class engineers in Printed Circuit Board assembly and is setting up production and client servicing operations in China headed by Ms. Mauricia Wang, its China Business Manager for Oxford Solders. Ms. Wang said that there are global concerns about the environment, resource and energy sustainability and their impact on the global economy particularly in China. The pace of global industrialisation needs to continue to ensure continuously improving global quality of life but with environmental sensitivity to ensure long term good health of our planet.

With this background, BizEsp is offering assembly materials products based on advanced European and American technologies that offer top performance combined with environmental responsibility. BizEsp is offering its 'green' products to clients in China at prices that are locally competitive with service standards not offered in China even by much larger established international competitors. Ms. Wang said that anyone wishing to use top quality PCB assembly materials such as lead free solder pastes and BGA spheres should contact BizEsp immediately including even if it is just to receive free trouble shooting advise and or to organise a training session. Further details and product data sheets are available from BizEsp or can be down loaded from the Company's web site www.bizesp.com or visit BizEsp at the Nepcon show in Shanghai, China April 8th -11th 2008 and also at the Nepcon show in Shenzhen, China August 2008.

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