Interlink Electronics to Share eSignature Success Stories at Upcoming LOMA Customer Service Conference

Camarillo, CA (PRWEB) March 4, 2008 -- Interlink Electronics, Inc. (OTC:LINK.PK) is proud to speak at the LOMA Customer Service Conference taking place March 3-5, 2008 at the Royal Pacific Resort in Orlando, FL. http://www.loma.org/customer.asp. Interlink's session, "eSignatures for the 21st Century" will detail key learnings based on several customer success stories that will help conference attendees successfully implement end-to-end electronic processes.

"Our presentation gives attendees practical information that is applicable to their own esignature projects," explains Rod Vesling, Senior Vice President and Officer for eTransactions at Interlink Electronics. "By providing best practices based on real-life deployment examples, we help organizations efficiently implement signature technology and achieve operational excellence."

The Interlink esignature (http://www.interlinkelectronics.com/esign) session will take place on March 5, 2008 from 11:00 a.m. to 12:00 p.m.

About Interlink Electronics Inc.

Interlink Electronics, Inc. (OTC:LINK.PK) provides the financial services industry as well as the healthcare and government sectors with the electronic signature platform needed to eliminate paper from critical business processes. Interlink's complete solution including esignature software, hardware, and services allows organizations to implement end-to-end electronic processes no matter where the signing takes place: in-branch, in-the-field or online. Interlink Electronics is also known for its family of MicroNav products, powered by the company's patented Force Sensing Resistor (FSR) technology and integrated in handheld consumer electronics devices. Headquartered in Camarillo, California, Interlink Electronics, Inc. also has offices in Japan, Hong Kong, and China. www.interlinkelectronics.com/esign

For additional information, please contact:

Nathalie Benoit

Interlink Electronics, Inc.

Cell: 805-279-2750

For Investor Relations information, please contact:

Michelle Lockard

Interlink Electronics, Inc.

805-484-8855 ext. 114

All registrations and trademarks are properties of their respective owners. IntegriSign is a registered trademark of Interlink Electronics, Inc. This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: business conditions and growth in the electronics industry and general economies, both domestic and international; lower than expected customer orders; delays in receipt of orders or cancellation of orders; competitive factors, including increased competition, new product offerings by competitors and price pressures; the availability of third party parts and supplies at reasonable prices; changes in product mix; significant quarterly performance uctuations due to the receipt of a significant portion of customer orders and product shipments in the last month of each quarter; problems or delays in reporting our results of operations to the public; and product shipment interruptions due to manufacturing problems. The forward-looking statements contained in this document regarding industry and review trends, industry product and technology acceptance, product mix and future business activities should be considered in light of these factors.

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